Hakutulokset
Hakutulokset
Haulla "258" löytyi 106 tulosta.
IEC/TR 62258-8:2008(E), which is a technical report, has been developed to facilitate the production, supply and use of semiconductor die products, including wafers; singulated bare die; die and wafers with attached connection structures; minimally or partially encapsulated die and wafers. This T ...
https://sales.sfs.fi/julkaisu.html.stx?id=374837
ISO 28258:2013 describes how to digitally exchange soil-related data. It aims to facilitate the exchange of valid, clearly described and specified soil-related data between individuals and organizations via digital systems, and enables any soil data producer, holder or user to find and transfer d ...
https://sales.sfs.fi/julkaisu.html.stx?id=239924
ISO 2588:2014 specifies a method for the drawing, from a lot, of whole pieces of leather to form a gross sample.The method is applicable to all kinds of leather of any type of tannage.
ISO 2588:2014 does not cover marking and storage of the gross sample.
The standards writing body responsible f ...
https://sales.sfs.fi/julkaisu.html.stx?id=296675
ISO 21258:2010 specifies a method for sampling, sample conditioning and determination of dinitrogen monoxide (N2O) content in the flue gas emitted from ducts and stacks to atmosphere. It sets out the non-dispersive infrared (NDIR) analytical technique, including the sampling system and sample gas ...
https://sales.sfs.fi/julkaisu.html.stx?id=150875
This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: wafers, singulated bare die, die and wafers attached connection structures and minimally or partially encapsulated die and wafers. This report contains an XML schema tha ...
https://sales.sfs.fi/julkaisu.html.stx?id=374834
IEC/TR 62258-4:2012 has been developed to facilitate the production, supply and use of semiconductor die products, including:
- wafers;
- singulated bare die;
- die and wafers with attached connection structures;
- minimally or partially encapsulated die and wafers.
This technical report con ...
https://sales.sfs.fi/julkaisu.html.stx?id=375797
ISO 2589:2016 specifies a method for determining the thickness of leather. The method is applicable to all types of leather of any tannage. The measurement is valid for both the whole leather and a test sample.
The standards writing body responsible for this document in Finland is Finnish Stand ...
https://sales.sfs.fi/julkaisu.html.stx?id=406416
IEC 62258-1:2009 has been developed to facilitate the production, supply and use of semiconductor die products, including:
- wafers,
- singulated bare die,
- die and wafers with attached connection structures,
- minimally or partially encapsulated die and wafers.
This standard defines the mi ...
https://sales.sfs.fi/julkaisu.html.stx?id=336682
https://sales.sfs.fi/julkaisu.html.stx?id=827787
https://sales.sfs.fi/julkaisu.html.stx?id=100018630
CLC/TR 62258-8:en – Semiconductor die products – Part 8: EXPRESS model schema for data exchange
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SFS-EN ISO 28258:en – Soil quality. Digital exchange of soil-related data (ISO 28258:2013)
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SFS-EN ISO 2588:en – Leather. Sampling. Number of items for a gross sample (ISO 2588:2014)
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SFS-EN ISO 21258:en – Stationary source emissions. Determination of the mass concentration of dinitrogen monoxide (N2O). Reference method: Non-dispersive infrared method (ISO 21258:2010)
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CLC/TR 62258-7:en – Semiconductor die products – Part 7: XML schema for data exchange
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CLC/TR 62258-4:en – Semiconductor die products – Part 4: Questionnaire for die users and suppliers
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SFS-EN ISO 2589:en – Leather. Physical and mechanical tests. Determination of thickness (ISO 2589:2016)
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SFS-EN 62258-1:en – Semiconductor die products – Part 1: Procurement and use
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SFS-EN ISO 28258:2013/A1:2019:en – Soil quality. Digital exchange of soil-related data. Amendment 1 (ISO 28258:2013/Amd 1:2019)
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SFS-EN ISO 2580-1 – Plastics. Acrylonitrile/butadiene/styrene (ABS) moulding and extrusion materials. Part 1: Designation system and basis for specifications (ISO 2580-1:1997)
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